PCB Design Service
Delivery term:The date of payment from buyers deliver within days-
Price:
Negotiable
- minimum:
- Total supply:
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Delivery term:
The date of payment from buyers deliver within days
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seat:
Guangdong
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Validity to:
Long-term effective
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Last update:
2019-10-18 01:08
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Browse the number:
311
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- Contactaixin:
Contactaixin:
jingxin2019(Mr.)
- Email: telephone: phone:
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Area:
Guangdong
Address:F2 Building 13, Building 17 Hongfa Industrial Park, Tangtou Road, Shiyan, Baoan District, Shenzhen, China.
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Website:
http://www.pcbassemblyems.com/ http://jingxin2019.nbtfzs.com/
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PCB Design Service
1. We offer One-shop PCAB/PCB manufacturing service
2.10 year of pcb design service and turnkey ODM/OEM experience
3. We can provide F4B,F4BK, Teconic,Arlon,Rogers materia PCB
4. Timely customizations PCBs and PCBAs
Detailed Terms
Technical requirement:
1) Professional Surface-mounting and Through-hole soldering Technolog
2) Various sizes like 1206,0805,0603 components SMT technology
3) ICT(In Circuit Test),FCT(Functional Circuit Test) technology.
4) PCB Assembly With UL,CE,FCC,Rohs Approval
5) Nitrogen gas reflow soldering technology for SMT.
6) High Standard SMT&Solder Assembly Line
7) High density interconnected board placement technology capacity
PCBA Technical Capacity
SMT |
Position accuracy: 20 um |
Components size: 0.4×0.2mm(01005) —130×79mm,Flip-CHIP,QFP,BGA,POP | |
Max. component height: 25mm | |
Max. PCB size: 680×500mm | |
Min. PCB size: no limited | |
PCB thickness: 0.3 to 6mm | |
PCB weight: 3KG | |
Wave-Solder |
Max. PCB width: 450mm |
Min. PCB width: no limited | |
Component height: Top 120mm/Bot 15mm | |
Sweat-Solder |
Metal type: part, whole, inlay, sidestep |
Metal material: Copper, Aluminum | |
Surface Finish: plating Au, plating sliver , plating Sn | |
Air bladder rate: less than20% | |
Testing |
ICT, Probe flying, burn-in, function test, temperature cycling, AXI – 2D and 3D automated X-ray inspection, AOI – automated optical inspection |
PCB Assembly Process
Drilling-----Exposure-----Plating-----Etaching & Stripping-----Punching-----Electrical Testing-----SMT-----Wave Soldering-----Assembling-----ICT-----Function Testing-----Temperature & Humidity Testing
Testing Services
X-Ray (2-D and 3-D)
BGA X-Ray Inspection
AOI Testing (Automated Optical Inspection)
ICT Testing (In-Circuit Testing)
Functional Testing (at the board & system level)
Flying Probe
Capabilities
Surface Mount Technology/ Parts (SMT Assembly)
Through-Hole Device/ Parts (THD)
Mixed Parts: SMT & THD assembly
BGA/ Micro BGA/ uBGA
QFN, POP & lead-less chips
2800 pin-count BGA
0201/ 1005 passive components
0.3/ 0.4 Pitch
PoP Package
Flip-chip under-filled CCGA
BGA Interposer/ Stack-up
FAQ
http://www.pcbassemblyems.com/